US Patent Issued to RICOH on Sept. 1 for "Resin composition, molded product, electronic component, and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,723,147, issued on Sept. 1, was assigned to RICOH COMPANY LTD. (Tokyo).

"Resin composition, molded product, electronic component, and electronic device" was invented by Natsuki Koike (Kanagawa, Japan) and Mitsuyo Matsumoto (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition contains a resin and talc, wherein the resin contains a Beta-1,3-glucan derivative resin with the main chain represented by the following Chemical Formula 1, and the talc has an average particle diameter of 10 micro metre or less, where R's each independently represent hydrogen atoms or alkyl carbonyl groups, at least one of R's is an alkyl carbonyl gr...