US Patent Issued to RF360 SINGAPORE on March 17 for "Integrated device comprising metallization interconnects" (Singaporean, Malaysian Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,937, issued on March 17, was assigned to RF360 SINGAPORE PTE. LTD. (Singapore).

"Integrated device comprising metallization interconnects" was invented by Poh Hoong Yong (Johor Bahru, Malaysia), Siew Li Poh (Singapore), Ren Bin Yang (Singapore) and Shan Chen (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated device comprising a die substrate; a die interconnection portion coupled to the die substrate; and a metallization interconnect coupled to the die interconnection portion. The metallization interconnect comprises an adhesion metal layer, a first metal layer coupled to the adhesion metal layer; a second metal layer coupled t...