US Patent Issued to Resonac Packaging on Aug. 4 for "Battery packaging material including substrate protective layer" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,700,631, issued on Aug. 4, was assigned to Resonac Packaging Corp. (Hikone, Japan).

"Battery packaging material including substrate protective layer" was invented by Keitaro Kawakita (Hikone, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The battery packaging material includes a substrate layer, a heat-fusible resin layer, a barrier layer arranged between the substrate layer and the heat-fusible resin layer, and a substrate protective layer as an outermost layer arranged on an outer side of the substrate layer. The substrate protective layer includes a binder resin, wax as solid fine particles, resin beads, and inorganic fine particles, and a gros...