US Patent Issued to RESONAC on Sept. 8 for "Cooling structure" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,732,057, issued on Sept. 8, was assigned to RESONAC Corp. (Tokyo).

"Cooling structure" was invented by Hiroaki Shouda (Tagawa, Japan), Takahiro Yamashita (Tagawa, Japan) and Kazutake Fujisawa (Tagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling structure includes a flow path configuration member including resin and forming a flow path through which a refrigerant flows, in which the flow path includes a protrusion that protrudes in a direction outside of the flow path from an inner wall at an upstream side in a direction in which the refrigerant flows, and a rectifier that rectifies the direction in which the refrigerant flows toward t...