US Patent Issued to RESONAC on Oct. 6 for "Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,752,360, issued on Oct. 6, was assigned to RESONAC Corp. (Tokyo).

"Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump" was invented by Kunihiko Akai (Tokyo), Masayuki Miyaji (Tokyo), Junichi Kakehata (Tokyo) and Yoshinori Ejiri (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solder bump forming member, a method for manufacturing a solder bump forming member, a method for manufacturing an electrode substrate provided with solder bumps. The solder bump forming member including: a base substrate having a plurality of recesses; and solder particle...