US Patent Issued to RESONAC on Nov. 3 for "Material design support apparatus, material design support method, and program" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,915, issued on Nov. 3, was assigned to RESONAC Corp. (Tokyo).

"Material design support apparatus, material design support method, and program" was invented by Shimpei Takemoto (Tokyo), Takeshi Kaneshita (Tokyo), Yu Okano (Tokyo) and Yoshishige Okuno (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A material design support apparatus for supporting optimization of a design condition for a material, the material design support apparatus including: a design condition setting unit configured to set a range of a design condition for a material; a required characteristic setting unit configured to set a range of a required characteristic of the materi...