US Patent Issued to RESONAC on March 17 for "Polyimide precursor, resin composition, insulated electric wire, and flexible substrate" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,577,350, issued on March 17, was assigned to RESONAC Corp. (Tokyo).

"Polyimide precursor, resin composition, insulated electric wire, and flexible substrate" was invented by Tomoaki Maeno (Tokyo), Yasunori Kawabata (Tokyo), Shota Aoyagi (Tokyo) and Arisa Yamauchi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a polyimide precursor including a polyimide precursor obtained by a reaction between a diamine compound and a tetracarboxylic dianhydride compound, in which the diamine compound contains at least one type selected from the group consisting of an aromatic diamine and an alicyclic diamine, the tetracarboxylic dianhydride compound ...