US Patent Issued to RESONAC on June 23 for "Method for using a buffer sheet" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,662,590, issued on June 23, was assigned to RESONAC Corp. (Tokyo).

"Method for using a buffer sheet" was invented by Yuta Koseki (Chiyoda-ku, Japan), Daisuke Fujimoto (Chiyoda-ku, Japan), Kumpei Yamada (Chiyoda-ku, Japan), Naoya Suzuki (Chiyodu-ku, Japan), Hitoshi Onozeki (Chiyodu-ku, Japan) and Hiroshi Takahashi (Chiyodu-ku, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a buffer sheet composition including a thermosetting compound, which buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component, when the electronic component is heated by the ...