US Patent Issued to Resonac on June 23 for "Maleimide resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor package" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,662,565, issued on June 23, was assigned to Resonac Corp. (Tokyo).

"Maleimide resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor package" was invented by Naoyoshi Sato (Tokyo), Shuji Gozu (Tokyo), Minoru Kakitani (Tokyo), Takao Tanigawa (Tokyo), Ryuji Akebi (Tokyo) and Chihiro Hayashi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof, and (B) a polymer having a hydrocarbon chain or a polyeth...