US Patent Issued to Resonac on July 14 for "Method for manufacturing semiconductor device including disposing an adhesive thermal insulation material on the semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,208, issued on July 14, was assigned to Resonac Corp. (Tokyo).

"Method for manufacturing semiconductor device including disposing an adhesive thermal insulation material on the semiconductor device" was invented by Tomoko Higashiuchi (Tokyo), Hiroshi Yokota (Tokyo), Tomohiko Kotake (Tokyo), Naoki Furukawa (Tokyo), Naoki Maruyama (Tokyo), Yutaka Okada (Tokyo) and Nozomi Matsubara (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor device, the method including: a step of disposing an adhesive thermal insulation material on a semiconductor device; a step of performing reflow of the semiconductor device havin...