US Patent Issued to Resonac on Aug. 11 for "Etching method and semiconductor element manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,908, issued on Aug. 11, was assigned to Resonac Corp. (Tokyo).

"Etching method and semiconductor element manufacturing method" was invented by Kazuma Matsui (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An etching method including an etching step of bringing, in the presence of plasma, an etching gas containing a fluorine compound with three or fewer carbon atoms having at least one bond of a carbon-oxygen double bond and an ether bond in a molecule into contact with a target etching member having an etching target and a non-etching target, and selectively etching the etching target in comparison with the non-etching target. A concentration ...