US Patent Issued to Resonac on Aug. 11 for "Adhesion removal method and film-forming method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,284, issued on Aug. 11, was assigned to Resonac Corp. (Tokyo).

"Adhesion removal method and film-forming method" was invented by Yosuke Tanimoto (Tokyo) and Shimon Osada (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are an adhesion removal method capable of removing sulfur-containing adhesions that adhere onto the inner surface of a chamber or the inner surface of a pipe connected to the chamber without disassembly of the chamber and a film-forming method. Sulfur-containing adhesions adhering onto at least one of the inner surface of a chamber (10) and the inner surface of a discharge pipe (15) connected to the chamber (10) are remo...