US Patent Issued to Resonac Hard Disk on April 21 for "Electrode filament connection member, chemical vapor deposition apparatus, and method for manufacturing recording medium substrate" (Singaporean, Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,914, issued on April 21, was assigned to Resonac Hard Disk Corp. (Chiba, Japan).

"Electrode filament connection member, chemical vapor deposition apparatus, and method for manufacturing recording medium substrate" was invented by Hiromitsu Tanuma (Yamagata, Japan), Shinichi Nakayama (Yamagata, Japan), Nor Razali Rohman Mumod Ali (Singapore) and Kok Sheng Lim (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrode filament connection member configured to be attached so as to pass through an outer wall of a chemical vapor deposition apparatus in which an electrode filament is disposed in a chamber is provided, and to form an electrical...