US Patent Issued to Renesas Electronics on Oct. 27 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,938, issued on Oct. 27, was assigned to Renesas Electronics Corp. (Tokyo).

"Semiconductor device" was invented by Yuki Yamamoto (Tokyo) and Hiroyuki Arie (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor substrate having a first main surface and a second main surface, a plurality of interlayer dielectric films, and a plurality of wiring layers stacked above the first main surface. Each of the plurality of interlayer dielectric films is interposed between two adjacent ones of the plurality of wiring layers and between one of the plurality of wiring layers closest to the first main surface in a first...