ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,581, issued on March 3, was assigned to RENESAS ELECTRONICS Corp. (Tokyo).
"Semiconductor device" was invented by Yasutaka Nakashiba (Tokyo) and Hiroshi Miyaki (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first semiconductor chip in which a first multilayer wiring structure including a first coil and a second coil is formed and a second semiconductor chip in which a second multilayer wiring structure including a third coil and a fourth coil is formed. The second semiconductor chip is joined to the first semiconductor chip such that the first coil (second coil) and the third coil (fourth coil) are overlapped...