ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,070, issued on Feb. 24, was assigned to RENESAS ELECTRONICS Corp. (Tokyo).
"Method of manufacturing semiconductor device" was invented by Ryusei Takaishi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding region is specified by having a horizontal line partially constituting crosshairs displayed on a monitor of a wire bonding apparatus superimposed on a first line segment of a first marker, and having a vertical line partially constituting the crosshairs superimposed on a first line segment of a second marker."
The patent was filed on Aug. 21, 2023, under Application No. 18/452,829.
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