US Patent Issued to RENESAS ELECTRONICS on Feb. 17 for "Semiconductor device with lead frame having an offset portion on a die pad" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,667, issued on Feb. 17, was assigned to RENESAS ELECTRONICS Corp. (Tokyo).

"Semiconductor device with lead frame having an offset portion on a die pad" was invented by Toshiyuki Hata (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package construction includes: a die pad, and a suspension lead remaining portion connected to the die pad. Here, an offset portion is provided from a peripheral edge portion of the die pad to the suspension lead remaining portion. Also, the suspension lead remaining portion has: a first end portion connected to the die pad, and a second end portion opposite the first end portion. Further, the second end portion of...