US Patent Issued to Renesas Electronics on Aug. 25 for "Semiconductor device and method of manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,141, issued on Aug. 25, was assigned to Renesas Electronics Corp. (Tokyo).

"Semiconductor device and method of manufacturing the same" was invented by Yukio Takahashi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A first conductor pattern is formed on a semiconductor substrate of a scribing region via an insulating film. A plurality of second conductor patterns connected to the first conductor pattern are formed on the first conductor pattern. A third conductor pattern connected to the plurality of second conductor patterns is formed on the plurality of second conductor pattern. The scribing region is cut off in a Y direction by using a dici...