ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,099, issued on Sept. 8, was assigned to Raytheon Co. (Arlington, Va.).
"Electronics packaging for moving platforms" was invented by Gary Willenbring (Waconia, Minn.), Jason Graham (Prior Lake, Minn.), Neal R. Whatcott (Carver, Minn.) and Jacob Modjeski (Saint Paul, Minn.).
According to the abstract* released by the U.S. Patent & Trademark Office: "In accordance with at least one aspect of this disclosure, a system includes one or more electronics boards and one or more plates configured to interleave the one or more electronics boards in a stack along an axis. When in the stack, an outer surface of the one or more plates is configured to form an outer mold line of a portion of a ...