US Patent Issued to Raytheon on March 31 for "Offset vertical interconnect and compression post for 3D-integrated electrical device" (California Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,525, issued on March 31, was assigned to Raytheon Co. (Arlington, Va.).

"Offset vertical interconnect and compression post for 3D-integrated electrical device" was invented by Andrew Clarke (Santa Barbara, Calif.), James Pattison (Goleta, Calif.) and Stuart Farrell (Goleta, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrical device including a substrate, a dielectric layer supported by the substrate having at least one vertical post disposed within a via hole of the dielectric layer, and at least one electrically conductive vertical interconnect laterally offset from the post. The post is configured to impart a non-tensile state to ...