US Patent Issued to Quanzhou Sanan Semiconductor Technology on Jan. 20 for "Flip-chip light emitting device and production method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,583, issued on Jan. 20, was assigned to Quanzhou Sanan Semiconductor Technology Co. Ltd. (Nanan, China).

"Flip-chip light emitting device and production method thereof" was invented by Weiping Xiong (Xiqing District, China), Xin Wang (Xiqing District, China), Zhiwei Wu (Xiqing District, China), Di Gao (Xiqing District, China), Chun-I Wu (Xiqing District, China) and Duxiang Wang (Xiqing District, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A flip-chip light emitting device includes a substrate, a light-emitting layer, a bonding layer disposed between the substrate and the light-emitting layer, and a protective insulating layer disposed over ...