US Patent Issued to QUALCOMM TECHNOLOGIES, RF360 SINGAPORE on June 23 for "Die package with guard structure to reduce or prevent material seepage into air cavity, and related fabrication methods" (Singaporean, German, Malaysian Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,972, issued on June 23, was assigned to QUALCOMM TECHNOLOGIES INC. (San Diego) and RF360 SINGAPORE PTE. LTD. (Singapore).

"Die package with guard structure to reduce or prevent material seepage into air cavity, and related fabrication methods" was invented by Yeng Kwan Hoo (Unterhaching, Germany), Emre Topal (Munich), Shook Foong Ho (Singapore), Poh Hoong Yong (Johor Bahru, Malaysia) and Huan En Ku (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Bare die package with guard to reduce or prevent material seepage into an air cavity, and related fabrication methods. In exemplary aspects, to avoid or reduce material (e.g., an encapsulation mate...