US Patent Issued to QUALCOMM on Sept. 8 for "Three-dimensional (3D) integrated circuit (IC) (3DIC) package employing a redistribution layer (RDL) interposer facilitating semiconductor die stacking, and related fabrication methods" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,542, issued on Sept. 8, was assigned to QUALCOMM Inc. (San Diego).

"Three-dimensional (3D) integrated circuit (IC) (3DIC) package employing a redistribution layer (RDL) interposer facilitating semiconductor die stacking, and related fabrication methods" was invented by Stanley Seungchul Song (San Diego), Jonghae Kim (San Diego), Je-Hsiung Lan (San Diego) and Periannan Chidambaram (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Three-dimensional (3D) integrated circuit (IC) (3DIC) package employing a redistribution layer (RDL) interposer facilitating semiconductor die ("die"), and related fabrication methods. The 3DIC package includes an RD...