US Patent Issued to QUALCOMM on Sept. 8 for "Inductor performance enhancement using an outer, peripheral patterned ground shield" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,486, issued on Sept. 8, was assigned to QUALCOMM Inc. (San Diego).

"Inductor performance enhancement using an outer, peripheral patterned ground shield" was invented by Jonghae Kim (San Diego), Je-Hsiung Lan (San Diego) and Ranadeep Dutta (Del Mar, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device is described, in which the device includes a substrate. The device includes a multiturn inductor coupled to the substrate. The device also includes a patterned ground shield on a periphery of the multiturn inductor and coupled to the substrate."

The patent was filed on Sept. 15, 2023, under Application No. 18/468,536.

*For further informatio...