US Patent Issued to QUALCOMM on Sept. 15 for "Inductor packages employing wire bonds over a lead frame to form integrated inductor(s), and related integrated circuit (IC) packages and fabrication methods" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,411, issued on Sept. 15, was assigned to QUALCOMM Inc. (San Diego).

"Inductor packages employing wire bonds over a lead frame to form integrated inductor(s), and related integrated circuit (IC) packages and fabrication methods" was invented by Kai Liu (Phoenix), Jui-Yi Chiu (Taichung City, Taiwan), Nosun Park (San Diego), Je-Hsiung Lan (San Diego), Jonghae Kim (San Diego) and Periannan Chidambaram (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Inductor packages employing wire-bonds over a lead frame to form integrated inductor(s), and related integrated circuit (IC) packages and fabrication methods. The inductor package includes one or m...