US Patent Issued to QUALCOMM on Oct. 27 for "Integrated circuit device having a substrate with a stepped configuration to accommodate at least two different solder ball sizes" (California Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,986, issued on Oct. 27, was assigned to QUALCOMM Inc. (San Diego).

"Integrated circuit device having a substrate with a stepped configuration to accommodate at least two different solder ball sizes" was invented by Aniket Patil (San Diego), Manuel Aldrete (Encinitas, Calif.), Zhijie Wang (San Diego), Piyush Gupta (San Diego) and Rajneesh Kumar (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) device includes a substrate. The substrate includes a first side having a stepped configuration having a first surface that is elevated relative to a second surface. The first surface includes first solder resist openings (SRO...