US Patent Issued to QUALCOMM on Nov. 3 for "Integrated device comprising elongated pads" (California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,721, issued on Nov. 3, was assigned to QUALCOMM Inc. (San Diego).

"Integrated device comprising elongated pads" was invented by Yangyang Sun (San Diego) and Amer Christophe Gaetan Cassier (La Jolla, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device comprising an integrated device. The integrated device comprising a die substrate; an interconnect portion coupled to the die substrate, a plurality of pillar interconnects and a passivation layer coupled to the interconnect portion. The interconnect portion includes a first plurality of pads and a second plurality of pads. The first plurality of pads are configured to provide a first pluralit...