US Patent Issued to QUALCOMM on Nov. 3 for "Device comprising wall pillar interconnects" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,898, issued on Nov. 3, was assigned to QUALCOMM Inc. (San Diego).

"Device comprising wall pillar interconnects" was invented by Yujen Chen (Taichung, Taiwan), Aniket Patil (San Diego) and Zhijie Wang (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprising a substrate and a passive device coupled to the substrate through a plurality of solder interconnects. The substrate comprises at least one dielectric layer; and a plurality of interconnects. The passive device comprises a die substrate; a plurality of under bump metallization interconnects; and a plurality of pillar interconnects coupled to the plurality of under bump metalli...