US Patent Issued to QUALCOMM on May 19 for "Physical layer TCI configuration" (Israeli Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,634,088, issued on May 19, was assigned to QUALCOMM Inc. (San Diego).

"Physical layer TCI configuration" was invented by Idan Michael Horn (Hod Hasharon, Israel), Shay Landis (Hod Hasharon, Israel), Yehonatan Dallal (Kfar Saba, Israel) and Amit Bar-Or Tillinger (Tel-Aviv, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects presented herein may enable a UE to be configured with various types of physical layer TCI configurations based on beam(s), carrier-frequencies, cells, and/or channels used by the UE for communication. In one aspect, a UE receives, from a network entity, an indication of a set of physical layer configurations that is capable ...