US Patent Issued to QUALCOMM on May 19 for "Body tied to source standard cell implementations in semiconductor-on-insulator (SOI) technology" (California Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,237, issued on May 19, was assigned to QUALCOMM Inc. (San Diego).

"Body tied to source standard cell implementations in semiconductor-on-insulator (SOI) technology" was invented by Ravi Pramod Kumar Vedula (San Diego) and Abhijeet Paul (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) device is described. The IC device includes a semiconductor-on-insulator (SOI) substrate having a first-type diffusion region. The IC device also includes a first, first-type transistor on the first-type diffusion region. The IC device further includes a second, first-type transistor on the first-type diffusion region. The IC device al...