US Patent Issued to QUALCOMM on May 12 for "Supplemental reconfigurable intelligent surfaces for downlink communication" (California Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,627,334, issued on May 12, was assigned to QUALCOMM Inc. (San Diego).

"Supplemental reconfigurable intelligent surfaces for downlink communication" was invented by Hung Dinh Ly (San Diego), Saeid Sahraei (San Diego), Yu Zhang (San Diego) and Krishna Kiran Mukkavilli (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and devices for wireless communication are described. A communication device, such as a user equipment (UE) may receive a configuration (for example, via control signaling) of a set of reconfigurable intelligent surfaces (RISs). The UE may select a primary RIS for bidirectional wireless communication (for example, upl...