US Patent Issued to QUALCOMM on May 12 for "Prediction of a material profile of a target object based on sensing" (California Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,625,088, issued on May 12, was assigned to QUALCOMM Inc. (San Diego).

"Prediction of a material profile of a target object based on sensing" was invented by Mohammed Ali Mohammed Hirzallah (San Marcos, Calif.) and Varun Amar Reddy (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the disclosure are directed to prediction of a predicted material profile of the target object based on measurement information associated with sensing (RF-S) signal(s). In an aspect, one or more actions are performed in response to the predicted material profile of the target object, the one or more actions including, e.g., constructing at least one digital t...