US Patent Issued to QUALCOMM on March 31 for "Substrate(s) for an integrated circuit (IC) package employing a core layer and an adjacent insulation layer(s) with an embedded metal structure(s) positioned from the core layer" (South Korean, American Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,709, issued on March 31, was assigned to QUALCOMM Inc. (San Diego).

"Substrate(s) for an integrated circuit (IC) package employing a core layer and an adjacent insulation layer(s) with an embedded metal structure(s) positioned from the core layer" was invented by Hi Moon (Suwon-si, South Korea), Joan Rey Villarba Buot (Escondido, Calif.) and Aniket Patil (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate includes a core layer and one or more metallization layers. The core layer provides stabilization to the substrate to reduce or avoid warpage. The core layer may include a glass material weaved throughout the core to provide stab...