US Patent Issued to QUALCOMM on March 31 for "Package substrate having embedded electronic component in a core of the package substrate" (South Korean, American Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,408, issued on March 31, was assigned to QUALCOMM Inc. (San Diego).

"Package substrate having embedded electronic component in a core of the package substrate" was invented by Seongryul Choi (Seongnam, South Korea), Kuiwon Kang (San Diego) and Jung Won Park (Gumi, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an aspect, an electronic device is disclosed that includes a core having an upper planar surface and an interior planar surface; a cavity extending at least partially through the upper planar surface of the core to the interior planar surface of the core; an electronic component mounted in the cavity, the electronic component i...