US Patent Issued to QUALCOMM on March 31 for "Integration cache for three-dimensional (3D) reconstruction" (California Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,592,022, issued on March 31, was assigned to QUALCOMM Inc. (San Diego).

"Integration cache for three-dimensional (3D) reconstruction" was invented by Kapil Garg (Fremont, Calif.) and Yifan Zhang (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects presented herein relate to methods and devices for data or graphics processing including an apparatus, e.g., a central processing unit (CPU). The apparatus may partition at least one frame into a set of two-dimensional (2D) pixel tiles, wherein the at least one frame is associated with a three-dimensional (3D) reconstruction (3DR) process. The apparatus may also detect whether one or more ...