US Patent Issued to QUALCOMM on March 31 for "Hybrid core substrate with embedded components" (South Korean, American Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,705, issued on March 31, was assigned to QUALCOMM Inc. (San Diego).

"Hybrid core substrate with embedded components" was invented by Jaehyun Yeon (San Diego), Suhyung Hwang (Rancho Mission Viejo, Calif.), Omar James Bchir (San Marcos, Calif.), Hyunchul Cho (Suwon, South Korea) and Yeoil Park (Sejong, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A hybrid core substrate with embedded components, and methods for making the same, are disclosed. In an aspect a hybrid core substrate comprises a rigid core, a first laminate layer structure disposed above and mounted to the top surface of the rigid core and having a cavity in which a first co...