US Patent Issued to QUALCOMM on March 24 for "Timelines for time division multiplexing modem envelope enhancements" (California Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,024, issued on March 24, was assigned to QUALCOMM Inc. (San Diego).

"Timelines for time division multiplexing modem envelope enhancements" was invented by Hobin Kim (San Diego), Jing Jiang (San Diego), Hari Sankar (San Diego), Kianoush Hosseini (San Diego) and Gabi Sarkis (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and devices for wireless communications are described. Some examples of the described techniques provide for time-division multiplexing (TDM) modem envelope enhancements. A user equipment (UE) may receive, from a network entity, a message scheduling a transport block or multiple transport blocks in a downl...