US Patent Issued to QUALCOMM on March 24 for "Package comprising a lid structure with a compartment" (California Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,508, issued on March 24, was assigned to QUALCOMM Inc. (San Diego).

"Package comprising a lid structure with a compartment" was invented by Youmin Yu (Escondido, Calif.), Wei Wu (Irvine, Calif.), Guoping Xu (San Diego) and Nader Nikfar (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprising a substrate, a first integrated device coupled to a first surface of the substrate, a lid structure coupled to the substrate, where the lid structure includes a first compartment comprising a side surface and an inner top surface, and a thermal interface material coupled to (i) the first integrated device and (ii) the side surface and the ...