US Patent Issued to QUALCOMM on March 24 for "Package bumps of a package substrate having diagonal package bumps" (Indian, American Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,528, issued on March 24, was assigned to QUALCOMM Inc. (San Diego).

"Package bumps of a package substrate having diagonal package bumps" was invented by Ashish Raj (Jamshedpur, India), Feng Zhu (San Diego) and Shailesh Kumar (Noida, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are techniques for integrated circuits (ICs). In an aspect, an IC package includes a package substrate having an upper surface, a lower surface, a first side, and a second side perpendicular to the first side. The package substrate includes a metallization structure. The IC package further includes an IC die attached to the upper surface of the package subst...