US Patent Issued to QUALCOMM on March 24 for "Method for protocol stack sharing in dual connectivity" (Chinese, American Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,090, issued on March 24, was assigned to QUALCOMM Inc. (San Diego).

"Method for protocol stack sharing in dual connectivity" was invented by Ling Xie (Beijing), Bhupesh Manoharlal Umatt (Poway, Calif.), Reza Shahidi (La Jolla, Calif.), Qingxin Chen (San Diego), Shan Qing (Shenzhen, China), Mutaz Zuhier Afif Shukair (San Diego), Tom Chin (San Diego), Hemanth Kumar Rayapati (San Diego), Tongxin Wang (Shanghai), Daniel Amerga (San Diego), Peng Hu (Beijing), Xuqiang Zhang (Beijing), Xiaoyu Li (Beijing), Liang Hong (Beijing) and Zhongsheng Li (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and devices for wireless communicatio...