US Patent Issued to QUALCOMM on March 24 for "High speed, low power hybrid deserializer for chiplet-to-chiplet communication" (California Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,587,178, issued on March 24, was assigned to QUALCOMM Inc. (San Diego).

"High speed, low power hybrid deserializer for chiplet-to-chiplet communication" was invented by Masoud Roham (San Diego) and Thomas Hua-Min Williams (Irvine, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A data conversion circuit has first cascaded flipflops, second cascaded flipflops and a first selection circuit. The first cascaded flipflops include a plurality of series-coupled dynamic flipflops configured to convert first data to second data. Each dynamic flipflop is configured to retain signaling state of its output based on a capacitance at its input. The second casc...