US Patent Issued to QUALCOMM on March 17 for "Through molding contact enabled EMI shielding" (California Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,956, issued on March 17, was assigned to QUALCOMM Inc. (San Diego).

"Through molding contact enabled EMI shielding" was invented by Je-Hsiung Lan (San Diego), Jonghae Kim (San Diego) and Ranadeep Dutta (Del Mar, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are examples of multi-die modules that includes a die (e.g., a power amplifier) and an adjacent die placed side-by-side and bonded onto a substrate with a mold compound. The die (e.g., a switch or a low noise amplifier) may be double EMI shielded to minimize or even eliminate EMI/noise coupling with the adjacent die (e.g., switch, low noise amplifier, etc.). Another mold compou...