US Patent Issued to QUALCOMM on March 17 for "Three-dimensional (3D) metal-insulator-metal capacitor (MIMCAP) including stacked vertical metal studs for increased capacitance density and related fabrication methods" (California Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,943, issued on March 17, was assigned to QUALCOMM Inc. (San Diego).

"Three-dimensional (3D) metal-insulator-metal capacitor (MIMCAP) including stacked vertical metal studs for increased capacitance density and related fabrication methods" was invented by Xia Li (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional (3D) metal-insulator-metal capacitor (MIMCAP) includes a plurality of center studs disposed within cavity walls of a plurality of cavities in a top plate. The center studs and the cavity walls are oriented orthogonal to a first metal layer and extend through a first via layer and a second metal layer. Each center s...