US Patent Issued to QUALCOMM on March 17 for "Electronic component placed on core of substrate" (California Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,966, issued on March 17, was assigned to QUALCOMM Inc. (San Diego).

"Electronic component placed on core of substrate" was invented by Hong Bok We (San Diego), Joan Rey Villarba Buot (Escondido, Calif.), Michelle Yejin Kim (Carlsbad, Calif.) and Kuiwon Kang (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an aspect, a substrate includes a core that includes a core dielectric and a first conductive pattern on a first surface of the core dielectric, and a first metallization structure over the first surface of the core dielectric. The first metallization structure includes a first dielectric, and the first dielectric has a first opening f...