US Patent Issued to QUALCOMM on June 9 for "Thermal mitigation for USB power delivery" (California Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,651,871, issued on June 9, was assigned to QUALCOMM Inc. (San Diego).

"Thermal mitigation for USB power delivery" was invented by Lalan Jee Mishra (San Diego), Richard Dominic Wietfeldt (San Diego), James Lionel Panian (San Marcos, Calif.) and Georgios Konstantinos Paparrizos (Foster City, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Thermal mitigation features may be included in a Universal Serial Bus (USB) cable assembly or in the USB receptacle portion of a device. In one aspect, one or both ends of a USB cable jacket may have greater thermal conductivity than the portion between them. The portion having the greater thermal conductivity may d...