US Patent Issued to QUALCOMM on June 30 for "Package comprising a substrate with interconnects" (California Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,572, issued on June 30, was assigned to QUALCOMM Inc. (San Diego).

"Package comprising a substrate with interconnects" was invented by Joan Rey Villarba Buot (Escondido, Calif.), Hong Bok We (San Diego), Michelle Yejin Kim (Carlsbad, Calif.) and Aniket Patil (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprising a substrate and an integrated device coupled to the substrate. The substrate includes a first dielectric layer, a second dielectric layer, a third dielectric layer, and a plurality of interconnects located in the first dielectric layer, the second dielectric layer and the third dielectric layer. The second dielectric ...