US Patent Issued to QUALCOMM on June 23 for "Package comprising a substrate with post interconnects and a solder resist layer having a cavity" (California Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,029, issued on June 23, was assigned to QUALCOMM Inc. (San Diego).

"Package comprising a substrate with post interconnects and a solder resist layer having a cavity" was invented by Joan Rey Villarba Buot (Escondido, Calif.), Zhijie Wang (San Diego), Hong Bok We (San Diego) and Aniket Patil (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprising a first substrate, a first integrated device coupled to the first substrate, and a second substrate, and a plurality of solder interconnects coupled to the first substrate and the second substrate. The first substrate comprises at least one first dielectric layer; a first plurality of ...