US Patent Issued to QUALCOMM on June 23 for "Integrated device comprising pillar interconnects with variable widths" (California Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,991, issued on June 23, was assigned to QUALCOMM Inc. (San Diego).

"Integrated device comprising pillar interconnects with variable widths" was invented by Wei Wang (San Diego), Dongming He (San Diego), Yangyang Sun (San Diego) and Wei Hu (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated device comprising a die portion that includes a plurality of pads and a plurality of under bump metallization interconnects coupled to the plurality of pads, where the plurality of under bump metallization interconnects comprises a first under bump metallization interconnect. The integrated device includes a plurality of pillar interconnects co...