US Patent Issued to QUALCOMM on June 16 for "Package comprising a substrate and an interconnection die configured for high density interconnection" (California Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,649, issued on June 16, was assigned to QUALCOMM Inc. (San Diego).

"Package comprising a substrate and an interconnection die configured for high density interconnection" was invented by Yangyang Sun (San Diego), Srikanth Kulkarni (Dublin, Calif.), Lily Zhao (San Diego) and Milind Shah (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprising a substrate comprising a first surface and a second surface; a first integrated device coupled to the first surface of the substrate; an interconnection die coupled to the first surface of the substrate; a first encapsulation layer coupled to the first surface of the substrate, wherein the ...