US Patent Issued to QUALCOMM on July 28 for "Package comprising a substrate with cavity and an integrated device with a step back side" (California Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,780, issued on July 28, was assigned to QUALCOMM Inc. (San Diego).

"Package comprising a substrate with cavity and an integrated device with a step back side" was invented by Joan Rey Villarba Buot (Escondido, Calif.), Aniket Patil (San Diego) and Zhijie Wang (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprising a first substrate; an integrated device coupled to the first substrate, wherein the integrated device comprises a step back side; a second substrate comprising a cavity, wherein the integrated device is located at least partially in the cavity of the second substrate; and an encapsulation layer coupled to the first s...